Sentry Yarn Enterprise Co., Ltd.
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IC Letter Grinding Machine

Product Category: Electronic Production Machinery/n.e.s.
Sales Method: Export, Manufacture
Min. Order Unit Price

Product Detail

Product Attribute:

  • Taiwan More >
  • ICF-840
  • 04/19/2003
  • 01/01/2011

Product Content Description:

1. To be able thoroughly grind off the letters on the
surface of IC to prevent the circuit board from being
counterfeited.
2. To use automatic material feeding and recovering without
hand touching the material to prevent form electrostatic
interference.
3. To grind with special grinding wheel plate without
causing surface being heated, the depth of the grinding
may be micro-adjusted.
4. To fit with diamond rectify to adjust the plane of the
grinding wheel plate at any time when necessary.
5. With small volume and high production efficiency, The
productivity of one machine is equivalent to five
skilled labors.
6. The machine is suitable for D.I.P IC type and S.M.D. IC
type. (SOP, SOJ and PLCC type etc.)

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