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PCB Singulating Laser Machine PCB Laser Cutting Machine,CWVC-5S

—marble, PCB Singulating, Laser Machine, PCB Laser Cutting Machine
Product Category: Laser Equipments
Sales Method: Export, Manufacture, Wholesale, OEM/ODM, Service, Retail
Payment Term: T/T, L/C, M/T, D/D, Check, D/P sight, Western Union
Trade Term (Incoterms): FOB, CFR, CIF, CIP, DAT
Min. Order Unit Price
1 Piece USD 5000 / Piece
1 Piece USD 5000 / Piece
Contact Info


Address: China (mainland) Guangdong Shenzhen,Fuyong Chongqing Road Baoan District

Product Detail

Product Attribute:

  • China (mainland) More >
  • CWVC-5S
  • ChuangWei
  • marble
  • CE Approval ISO9001
  • 1000mm*940mm *1520 mm
  • Q-Switched diode-pumped all solid-state UV laser
  • 355nm
  • 10W/12W/15W/17W@30KHz
  • 09/04/2018
  • 09/04/2018

Product Content Description:

1. Neat and smooth edge, no burr or overflow
2. More quick and easy, shorten the delivery time;
3. High quality ,no distortion,surface clean& uniformity;
4. Gathering the CNC tech,laser tech,software tech…High accuracy,High speed

Working principle : 
humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters  ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balancespring ( general balance spring with alloy )

Laser Q-Switched diode-pumped all solid-state UV laser
Laser Wavelength 355nm
Laser Power 10W/12W/15W/17W@30KHz
Positioning Precision of Worktable of Linear Motor ±2μm
Repetition Precision of Worktable of Linear Motor ±1μm
Effective Working Field 460mmX460mm(Customizable)
Laser Scanning Speed 2500mm/s (max)
Galvanometer Working Field Per One Process 40mmх40mm

·         Auto vision positioning
·         Cost saving – no consumables and die wear
·         Able to cut odd, complex and micro shape section out of PCBs
·         No mechanical stress on product
·         Quick model change turnaround time
·         Excellent cut finish

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming

Laser Source:

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