Xinxunwei Technology Co., Ltd.
Home > Products > Welding & Soldering Supplies/n.e.s. > 0.30Mm*25Wpcs BGA Solder Ball Leaded

0.30Mm*25Wpcs BGA Solder Ball Leaded

— BGA Solder Ball, BGA Servicing Consumable Items, BGA Repairable Part
Product Category: Welding & Soldering Supplies/n.e.s.
Sales Method: Export, Manufacture, Wholesale, Retail
Payment Term: T/T, L/C, Western Union
Min. Order Unit Price
5 Pieces USD 9.77 / Piece
Contact Info


Address: China (mainland) Guangdong Shenzhen,Floor 3, Xinfuwei Industrial Zone, Xintang Industrial Park, Baoan District

Product Detail

Product Attribute:

  • China (mainland) More >
  • 0.30mm
  • Entai
  • 03/04/2014
  • 03/04/2014

Additional Info.:

  • shenzhen

Product Content Description:

0.30mm*25W pcs BGA solder ball
Standard package by manfacturer
Leaded composition
0.300mm Leaded solder ball
Brand: Taiwan Entai
Producing areaTaiwan
Component: Sn63/Pb37
Solder ball diameter: 0.300mm
Package: Antistatic material, 25Wpcs/bottle
Entai Sicence and Technology CO., Ltd is one of the solder ball manufacturers authenticated by TS 16949.
Solder ball's diameter can be 75um, there is a few manufacturers which can make that craft.
Sphere diameter's tolerance is the strict, internally piloting tolerance is only 8um, far lower than the standard 10-25um in the industry.
Refining material made by self, strengthen solder ball's welding ability, and increase the rate of welding.
Added microelement increase solder's antioxidant ability and reliability.
Packing material adopts antistatic material and fits ROHS standard.
What is solder ball:
Solder balls mainly connect semiconductor chip and line-moldboard or PCB board, they are the smallest electronic component transmitting electronic signal.
Quantity Per Month: 500 Pieces
Delivery Way - Date Of Delivery: 1 week

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